DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。

The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method and GUI …

DISCO Technical Review Kiru（切る）・Kezuru（削る）・Migaku（磨く）技術に関する技術見解・ 論文のページです。

This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the KABRA layer. In …

DAG811 Surface Grinder Automatic Φ200 mm 1 axis, 1 chuck table

The next generation successor to the standard model, supports Φ8-inch wafers DFG8541 is the next generation equipment of DFG8540, which is a dual-spindle standard model grinder that handles …

Thin grinding (100 µm) Advanced handling systems and design features facilitate high yield for thin wafer grinding. Design flexibility The DFG8560 can be integrated with DISCO's Dicing Before …

Your Nearest DISCO Office DISCO HI-TEC AMERICA, INC. USA Head Office Sales & Service Office

DGP8761 グラインダポリッシャ フルオートマチック Φ300 mmウェーハ対応 3軸4チャックテーブル

As it is expected that the demand for DISCO’s precision processing tools, which are used in the manufacturing of semiconductors and electronic components, will also continue to increase, there is …