Since the 1920s, sheet steel has been the most commonly utilized structural material in the automobile industry, with steel’s strength and stiffness making it ideally suited for durable chassis and ...

Korean researchers revealed that efficiency losses in heterojunction solar cells arise from two coexisting defect types – dangling bonds and weak silicon-silicon bonds. Their findings explain how ...

Modern advanced packaging processes and shrinking semiconductor device sizes mean that it is vital to consistently eliminate sub-20 nm defects and surface contaminants. To do this effectively, the ...

Abstract: Identifying upstream processes responsible for wafer defects is challenging due to the combinatorial nature of process flows and the inherent variability in processing routes, which arises ...

Abstract: Frequent pattern mining from defect repositories has started playing an important role in software defect detection and analysis. In this paper, we present a new improved template-based ...

Detecting sub-5nm defects creates huge challenges for chipmakers, challenges that have a direct impact on yield, reliability, and profitability. In addition to being smaller and harder to detect, ...

Software defect prediction and cost estimation are critical challenges in software engineering, directly influencing software quality and project management efficiency. This study presents a ...

Software development methodologies have evolved significantly, transitioning from traditional Waterfall models to more flexible Agile frameworks. However, the role of Quality Assurance (QA) in Agile ...

A new technical paper titled “Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging” was published by researchers at Arizona State University. “Fan-out ...