Elpida Memory, Inc., announced that is has developed its new 90 nm production process for high-performance DRAM products. 90 nm (or 0.09 micron) is the next-generation measurement for silicon wafer ...

The 300mm silicon carbide wafer targets higher production capacity for power electronics and advanced system integration.

In the center of this technological transition, Future Leading SiSiC/RBSIC/silcon carbide Cantilever Paddle products are emerging as a key solution for stable wafer handling and continuous kiln ...

Veeco Instruments and research organisation imec have jointly developed a manufacturing process that enables the integration of barium titanate onto 300mm silicon photonics wafers, addressing a ...

Manhasset, N.Y. — Cascade Microtech has rolled out the eVue digital imaging system for semiconductor wafer navigation and testing. Designed primarily for engineers who do process development or device ...

TOKYO--(BUSINESS WIRE)--Mitsubishi Electric Corporation (TOKYO:6503) announced today that the company has completed installation of its first 12-inch silicon wafer processing line at its Power Device ...

PORTLAND, Ore.--(BUSINESS WIRE)--Electro Scientific Industries, Inc. (NASDAQ:ESIO), an innovator in laser-based micromachining solutions, today unveiled its Ultrus TM laser processing system, designed ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

A silicon wafer is a thin slice of crystalline silicon typically grown using the Czochralski process, which involves pulling a crystal seed from a molten silicon bath. A silicon wafer is a thin slice ...

Key opportunities include the rise in high-performance computing & automotive applications, the expansion driven by 5G ...

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...