As the relatively mature wire-bonding technology continues to advance, it has become fully suitable for processing automotive silicon-based IGBT modules, and SiC (silicon carbide) power modules and is ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart ...
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of the RG600QA and RG660QB 5G module, based on the Qualcomm® X85 and X82 5G Modem-RF Systems. The ...
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