TORONTO, Aug. 12, 2025 /PRNewswire/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing ...
Extensive Array of Back-End and Advanced Packaging Wet Wafer Process Equipment Leverages ACM’s Experience to Address Emerging Requirements for Wafer-Level Packaging FREMONT, Calif., Oct. 15, 2020 ...
Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...
The 350 mm diameter center opening in the RotoRing300 TM rotary table easily accommodates large 300 mm (12”) semiconductor wafers, allowing for eased extraction of the chip dies from the wafer during ...
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Sanctions shadow falls over Intel after testing advanced wafer processing systems
New reporting revealed that Intel evaluated advanced chip-making equipment from a supplier connected to previous U.S. sanctions. The information drew strong reactions across the tech industry because ...
DUBLIN--(BUSINESS WIRE)--Research and Markets (http://www.researchandmarkets.com/research/zjghfx/silicon_wafers) has announced the addition of the "Silicon Wafers for ...
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In an update to its International Technology Roadmap for Photovoltaics, German engineering association the VDMA notes standardization of wafer size is a topic of great interest to the country’s PV ...
San Jose-based Exsil Inc. said it has developed a high quality restoration process for gallium arsenide (GaAs) wafers. The process would allow GaAs fabs to reclaim and reuse wafers within their ...
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