ANDOVER, Mass., Jan. 22, 2024 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today introduced ...
IC packaging continues to play a big role in the development of new electronic products, particularly with system-in-package (SiP), a successful approach that continues to gain momentum — but mostly ...
IZMO today announced that its specialized division, izmo Microsystems, has successfully designed a high complexity 3D System-in-Package (SiP) module for Space Payload Camera Electronics. This ...
Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 ...
CHANDLER, Ariz., Aug. 04, 2022 (GLOBE NEWSWIRE) -- As the embedded market continues to grow rapidly and evolve, developers are seeking to optimize product development, or they may need to transition ...
The goal of this article is to walk through what is SOM (system on module), which all are available most commonly SOM today in the market, and the benefits of uses. This article will provide a ...
Microchip Technology Inc. unveils a new System on Module (SOM) featuring the SAMA5D2 MPU, which greatly simplifies design by integrating the power management, non-volatile boot memory, Ethernet PHY ...
The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results
Feedback