Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

Raads Generator: An EDA tool based on large-scale language models (LLMs). When designers input semiconductor specifications, Raads Generator outputs register-transfer level (RTL) design data optimized ...

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of ...

Under the Department of Commerce, the program will provide funding for research and development projects to support U.S. semiconductor advanced packaging and strengthen the manufacturing and packaging ...

FREMONT, Calif., July 29, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...

YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications by a Leading AI Infrastructure Supplier Yield Engineering Systems (YES), a leading provider ...

Nvidia partnerships, $7B Arizona advanced packaging, 2026 growth catalysts & undervalued P/S vs. peers. Click here for more ...

GS Microelectronics U.S., Inc. (GSME) today announced a $35 million Series B round led by Maverick Silicon to expand its semiconductor services platform across advanced packaging, design enablement, ...

SEMICON Taiwan 2024 featured the latest trends and innovations that focused on the future of Artificial Intelligence (AI) to connect Taiwan and global semiconductor ecosystems. The high demand and ...

Multi-die assemblies offer significant opportunities to boost performance and reduce power, but these complex packages also introduce a number of new challenges, including die-to-RDL misalignment, ...