PITTSBURGH--(BUSINESS WIRE)--May 13, 2005--Alcoa (NYSE:AA) announced today that its Brazilian affiliate, Alcoa Aluminio, has joined Tetra Pak, Klabin and TSL Ambiental to inaugurate the world's first ...

(MENAFN- Mid-East Info) Before an airplane is assembled, its components must be manufactured and shipped to the assembly plant and sometimes stored. This critical period can lead to the uneventful ...

Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in 2025, the advanced ...

Embedded die packaging is seeing renewed demand amid the push towards chips and systems that require smaller form factors. ASE, AT&S, GE, Shinko, Taiyo Yuden, TDK, Würth Elektronik and others compete ...

In order to assist manufacturers in complying with the ISO 11607 standard requirements for packaging process development, equipment manufacturers are increasingly incorporating validation software and ...

Moore’s Law in process technology is on its last legs, so advanced packaging is taking up the baton. Advanced techniques such as fan-out wafer-level packaging (FOWLP) allow increased component density ...

Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

"This new group integrates KLA's acquisition of the Orbotech and SPTS business to bring complementary technologies, products and services into one organization to drive innovation and results in ...