Concurrent design of a chip and its packaging environment is becoming more important than ever for several reasons. Designing a large, high power die, e.g. a System-on-Chip (SoC), without considering ...
A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” was written by researchers from Amkor. Find the technical paper here.
The previous articles of this series have discussed the innovation and evolution of the integrated-circuit industry and how system-in-package (SiP) devices fit into the market. In the first article, ...
Medical packaging sits at the intersection of materials science, sterilization, human factors, and global regulatory ...
Copper interconnects cannot deliver the high-performance requirements of modern systems, especially with the rapid expansion ...
New York, Aug. 24, 2021 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Cell Therapy Packaging Products and Services Market by Type of Therapy, Package Engineering Design, ...
Dublin, July 10, 2024 (GLOBE NEWSWIRE) -- The "Cell Therapy Packaging Market: Industry Trends and Global Forecasts, till 2035 - Distribution by Type of Therapy Packed, Package Engineering Design, ...
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