Union Minister Ashwini Vaishnaw announced on January 27 that the government aims to manufacture 3-nanometre (3nm) chips ...

The Indian government, led by Union Minister Ashwini Vaishnaw, plans to produce 3-nanometer chips by 2032 to enhance domestic tech capabilities. The second phase of the Design-Linked Incentive Scheme ...

Startup Substrate is building next-generation semiconductor fabs using advanced X-ray lithography. This goes beyond extreme ...

The Indian government aims to produce high-tech 3-nanometer chips by 2032, as part of its Design-Linked Incentive Scheme. The initiative focuses on advancing the domestic chip ecosystem, covering six ...

Union minister Ashwini Vaishnaw announced Tata's Dholera fab will assist Indian chip startups with design tape-outs, aiming ...

Rapidus Corp., a Tokyo-based chip manufacturing startup, reportedly plans to build a fab capable of making 1.4-nanometer processors. Nikkei Asia reported the initiative today. The fab could create ...

Minister of Electronics and Information Technology Ashwini Vaishnaw on Tuesday expressed confidence that as the country moves towards 2029, and the second phase of country''s semiconductor mission ...

Centre is targeting to make high-tech small chips of 2-3 nanometer (nm) node that are used in products like modern ...

India plans to manufacture advanced 3-nanometre semiconductor chips by 2032, Union Minister Ashwini Vaishnaw has said.

India targets indigenously designed 3nm chips by 2032, with plans to boost fabless startups and make the country a global semiconductor design hub ...

New Delhi, Jan 27 (UNI) Minister of Electronics and Information Technology Ashwini Vaishnaw on Tuesday expressed confidence that as the country moves towards 2029, and the second phase of country's ...