December 13, 2013. The ContourSP large-panel metrology system more than doubles the measurement throughput of the high-density interconnect (HDI) substrates in multichip modules (MCM) over previous ...
As PCB hybrid manufacturing makes greater inroads with microelectronics manufacturing, new inspection tools are coming to the fore. In our industry, microelectronics manufacturing is increasingly ...
Bruker Corporation has announced that it has launched the ContourSP large panel metrology system, which more than doubles the measurement throughput of the high-density interconnect (HDI) substrates ...
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