The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...
A packaging process developed by Amkor Technology of Chandler, Ariz., is being described by the company as the packaging equivalent of a semiconductor move from 200- to 300-mm wafers. The company's ...
Packaging advances are driving innovation at KLA-Tencor, which in May announced two new systems that support advanced semiconductor packaging technologies: CIRCL-AP and ICOS T830. Designed for ...
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