Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in ...
HSINCHU, Taiwan — September 10, 2008 — Rohm and Haas Electronic Materials (NYSE:ROH), CMP Technologies, a leader and innovator in chemical mechanical planarization (CMP) technology for the global ...
The method of Chemical mechanical polishing/planarization (CMP) is commonly employed in the microelectronic industries to smooth surfaces with a blend of chemical and mechanical forces. This method ...
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