PARIS — STMicroelectronics NV announced it has joined Imagine, a CEA-Leti program focused on electron-beam direct write lithography for IC manufacturing for 22-nm and beyond. Intended to operate for ...
Leti has integrated hybrid III-V silicon lasers on 200mm wafers using standard CMOS process flow. This shows the way to transitioning away from 100mm wafers and a process based on bulk III-V ...
Leti, a research institute of CEA Tech, and Mapper Lithography, a specialist provider of maskless lithography equipment for the semiconductor and nanofabrication industries, have announced a low-cost ...
SANTA CLARA, Calif. and HSINCHU, Taiwan, Oct. 08, 2025 (GLOBE NEWSWIRE) -- Following the launch of its Japan sales operation earlier this year and with fresh funding from global investors, Multibeam ...
Silicon photonics uses existing CMOS manufacturing infrastructure and techniques but lacks mature models that take into account known CMOS process variations and their effect on photonic component ...
SAN FRANCISCO — At this week's International Electron Devices Meeting (IEDM) here, IBM, Intel, TSMC and the NEC/Toshiba duo will separately present papers on 32-nm processes with high-k and metal ...
A Grenoble, France-based research team at CEA Leti and chip maker STMicroelectronics say that they have demonstrated the first hybrid III-V/silicon laser to be fabricated using a wafer manufacturing ...
imec has announced it has successfully implemented the world's first 300mm fab compatible Directed Self Assembly (DSA) process line under one roof. Sited in imec's 300mm cleanroom fab, the upgrade of ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback